The main service of Division I is for marketing LED and Semi Conductor's Encapsulate, Molding Compound, Print Circuited Board Ink, etc. from Europe, USA and Japan. We provide the total solution for our clients.

Due to the development of Taiwan Electronics Industry and our loyal clients' supports, our sales have been growing steady. We are now the leading professional sales and service in this field.

In order to provide effective services to domestic and international customers, we have established braches in Shanghai, Guangzhou, Tianjin and Fuzhou in China. And our headquarter is in Taipei Taiwan.

We, as Division I, appreciate our team and loyal customers whom make us keep going forward. Our goal is to continue to provide the highest quality products and best services to our customers.

¡½LED Light Emitting Diode
 
¡@Liquid encapsulants  

Brand Type Description Purpose Characteristic
IK HL8800 A/B part ¡Aclear for traditional lamp¡BHigh bright product: outdoor screen/Flux-fill type LED high performance, excellent reliability / CHMSL
¡@ HL8800-850 A/B part ¡Ablack for IRDA¡]750nm¡B850nm¡^ already add black color dye for cutting visible light
¡@ HL2002 A/B part ¡Aclear for Top View LED/SMD LED good adhesion to PPA,excellent reliability,for blue¡Bwhite chip
¡@ HL1601 A/B part ¡Aclear for Top View LED/SMD LED low stress, for blue¡Bwhite chip
¡@ IK0001 A/B part ¡Aclear low stress, for traffic light, tradtional lamp low stress¡Bflexibility same as Hysol HL3100-3,
¡@ IK0002 A/B part ¡Aclear for display low stress, same as Hysol HL4210
¡@ ST-1L A/B part ¡Aclear for lamp not yellowing, high TG, for automobile and outdoor display
 
¡@Mold compound¡@  

Brand Type Description Purpose Characteristic
HYSOL MG18 series epoxy molding compound for the encapsulation of Lead-Frame several special colors are available, liquid type (B-stag)
¡@ OP1000 clear epoxy molding compound for the encapsulation of Lead-Frame¡BSMD LED power typed. Low moisture absorption,not yellowing,for white¡Bblue chip and super bright. Could pass Red-Ink Test
¡@ OP1030 clear epoxy molding compound suitable for IRDA & IRM Product power typed. High performance, high reliability test
¡@ OP8000 clear epoxy molding compound for the encapsulation of Lead-Frame¡BSMD LED power typed. contain internal release
 
¡@other products¡@  

Brand Type Description Purpose Characteristic
IK AC4368E Silicon Oil super mold release agent, higher quality releasability, pail and spray can are available
¡@ A6003 ¡@ diffuser component is Silica
¡@ AI3511 ¡@ blue dye ¡@
Hysol MCL100 melamine cleaning compound for cleaning molds higher quality releasability
¡@ MCL-200C melamine cleaning compound for cleaning molds higher quality releasability,in square preforms